HPW designation:

HPW-302Cp

Abbreviation DIN EN 1044:

CP 302

DIN 8513

-

DIN EN ISO 17672

CuP 386

EN ISO 3677: 1995

B-Cu86SnP-650/700

Composition (mass fraction in%):

Cu 85,0 - 87,0 % | Sn 6,5 - 7,5 % | P 6,4% - 7,2 %

Working temperature ° C:

0700 °C

Temperature ° C:

Solidus 650 °C, Liquidus 700 °C

Tensile strength of the soldering [N/mm²]

250

density[g/cm³] :

8,0

application

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