HPW designation:
HPW-302Cp
Abbreviation DIN EN 1044:
CP 302
DIN 8513
-
DIN EN ISO 17672
CuP 386
EN ISO 3677: 1995
B-Cu86SnP-650/700
Composition (mass fraction in%):
Cu 85,0 - 87,0 % | Sn 6,5 - 7,5 % | P 6,4% - 7,2 %
Working temperature ° C:
0700 °C
Temperature ° C:
Solidus 650 °C, Liquidus 700 °C
Tensile strength of the soldering [N/mm²]
250
density[g/cm³] :
8,0
application