HPW designation:
HPW-208Ag
Abbreviation DIN EN 1044:
AG 208
DIN 8513
L-Ag5
DIN EN ISO 17672
Ag 205
EN ISO 3677: 1995
B-Cu55ZnAg(Si)-820/870
Composition (mass fraction in%):
Cu 54,0 - 56,0% | Zn 38,0 - 42,0% | Ag 4,0 - 6,0% | Si 0,05 - 0,25%
Working temperature ° C:
0860 °C
Temperature ° C:
Solidus 820 °C, Liquidus 870 °C
Tensile strength of the soldering [N/mm²]
400
density[g/cm³] :
8,4
application