HPW designation:

HPW-208Ag

Abbreviation DIN EN 1044:

AG 208

DIN 8513

L-Ag5

DIN EN ISO 17672

Ag 205

EN ISO 3677: 1995

B-Cu55ZnAg(Si)-820/870

Composition (mass fraction in%):

Cu 54,0 - 56,0% | Zn 38,0 - 42,0% | Ag 4,0 - 6,0% | Si 0,05 - 0,25%

Working temperature ° C:

0860 °C

Temperature ° C:

Solidus 820 °C, Liquidus 870 °C

Tensile strength of the soldering [N/mm²]

400

density[g/cm³] :

8,4

application