HPW designation:
HPW-5050Au
Abbreviation DIN EN 1044:
-
DIN 8513
-
DIN EN ISO 17672
Au 503
EN ISO 3677: 1995
B-Au50Cu-955/970
Composition (mass fraction in%):
Au 50,0% | Cu 50,0%
Working temperature ° C:
0970 °C
Temperature ° C:
Solidus 955 °C, Liquidus 970 °C
Tensile strength of the soldering [N/mm²]
k.A.
Density[g/cm³] :
12,2
Application
Steel, noble metal, copper and copper alloys, nickel and nickel alloys, heat-resisting up to 200°C