HPW designation:

HPW-5050Au

Abbreviation DIN EN 1044:

-

DIN 8513

-

DIN EN ISO 17672

Au 503

EN ISO 3677: 1995

B-Au50Cu-955/970

Composition (mass fraction in%):

Au 50,0% | Cu 50,0%

Working temperature ° C:

0970 °C

Temperature ° C:

Solidus 955 °C, Liquidus 970 °C

Tensile strength of the soldering [N/mm²]

k.A.

Density[g/cm³] :

12,2

Application

Steel, noble metal, copper and copper alloys, nickel and nickel alloys, heat-resisting up to 200°C